Automatic wafer sample polishing and inspection system 115/230VAC 60/50Hz, 500W Option: SECMW Manual included Monitor, keyboard and mouse are not included.

GATAN / SAGITTA Next-1 ECP-1004 is a high quality wafer grinding, lapping and polishing equipment designed for production and research applications.

GATAN / SAGITTA Next-1 ECP-1004 is a complete wafer grinding, lapping and polishing equipment designed to deliver excellent results in today's demanding ...

The Next-1 ECP-1004 is a wafer grinding system designed for 100-150mm wafers. It uses advanced technology to achieve precise and uniform wafer thinning ...

Find the best deals on 2 used Wafer Grinding, Lapping & Polishing SAGITTA, or send us a request for an item and we will contact you with matches available ...

Lapping is a mechanical process in which a pad is used with polishing liquid to to remove excess silicon from a wafer substrate, often producing a dull grey ...

High precision, tight tolerances, and minimal damage depths are the results of our silicon wafer and silicon component lapping and polishing services.

SAGITTA Centar is a comprehensive wafer grinding, lapping, and polishing equipment suitable for processing various types of materials, from metals to ...